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| Customization: | Available |
|---|---|
| After-sales Service: | Onlin |
| Warranty: | 1 |
| Model NO. | CY-ALD |
| Type | Coating Production Line |
| Coating | Vacuum Coating |
| Certification | CE |
| Condition | New |
| Wafer Dimension | 8 Inch and Below |
| Wafer Temperature | Rt-400c, Controlling Precision +-0.1c |
| Number of Precursor | Three Precursor Lines, Optional More Lines |
| ALD Valve | Swagelok Ald Swift Valve |
| Gas Carrier System | N2 or Ar |
| HS Code | 8412800090 |
CVD ALD Atomic Layer Deposition System for Powder Coating Plating
Thermal Atomic Layer Deposition System is a single-wafer deposition system specially designed for scientific research and small-scale experiments of industrialization. The system completely accords with the CE criterion. It is widely used in the fields of micro-electronics, nano materials, optical films, solar batteries, etc.
Advanced software controlling system: many functions are integrated in the system, including technological formulation, parameter setting, popedom setting, interlocking alarming and state supervisory control.
| Wafer Dimension | 8 inch and below |
| Wafer temperature | RT-400ºC, Controlling precision ±0.1ºC |
| Number of precursor | Three precursor lines, optional more lines |
| Temperature of precursor lines | RT-200ºC, Controlling precision ±0.1ºC |
| ALD Valve | Swagelok ALD swift valve |
| Background vacuum | <5*10-3 Torr |
| Gas carrier system | N2 or Ar |
| Growing mode | Consecutive or interval deposition mode |
| Controlling system | PLC plus touch screen or display |
| Depositon Heterogeneity | Heterogeneity < ±1% |
| Dimension of the instrument | 600mm x 600mm x 1100mm |








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